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Universal Instruments Innova Direct Die Feeders コンポーネント包装機

  • Manufacturer:Universal Instruments
    Model: Innova Direct Die Feeders
    Guarantee: 12 Month
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Innova Direct Die Feeders support a full complement of high-volume flip chip and bare die applications. Innova enables high-speed die delivery from wafer over a wide range of die sizes. When integrated with the flexible GenesisSC Platform, Innova eliminates the need for dedicated die presentation systems to streamline processes and improve efficiency.

  • Ideal for SiP applications

  • High-mix to high-volume support

  • Handles up to 300mm wafers

  • Inline barcode scanning supports ALPs or Inkless wafer maps

  • Supports up to 4 per machine


                    Innova - High-speed flip chip and bare die presentation from a single wafer
                    Innova + - High-speed flip chip and bare die presentation with a cassette supporting up to 13 wafers 



                    • Quality Engagement
                    • Easy change and return
                    • Delivery Avaliable
                    • Favorable payment

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